Printed Circuit Board Capabilities and Tolerances

Below are the circuit board capabilities and tolerances that we can currently manufacture. We are working to expand our PCB offerings so please revisit this page frequently for updates.

We offer very high-end features and capabilities at competitive pricing:

• Rigid PCBs up to 42 layers
• 2.5-mil traces and 3.5-mil spaces
• Minimum Mechanical drill size 8-mil
• Minimum Laser drill size 3-mil
• ISO-9001 and UL certified
• Controlled Impedance
• Blind/Buried Vias
• Class III
• RoHS Compliant (all options available)
• High temperature, high frequency material
• Aluminum & other special material

Download our Printed Circuit Board Flyer, includes PCB Manufacturing Specifications

PCB Types
CAP or Foil Construction	Controlled Impedance
Blind / Buried Via	Mixed Inner Copper Weights
Flex	Mixed Materials
Rigid-Flex	(HDI) High Density Interconnect

 

Aluminum Core PCB
Single, Double Sided, and Multi-Layer Aluminum Core

 

Item	English	Metric
LAMINATE
Max Board Thickness	314.96 mil	8.00 mm
Min Board Thickness (2 Layers)	6 mil	0.15 mm
Min Board Thickness (4 Layers)	11.8 mil	0.3 mm
Min Core Thickness (Not including copper)	2 mil	0.05 mm
Largest Panel Size	22.5" x 33.5"	571 mm x 850 mm
Min Pre-Preg Thickness	2.3 mil	0.051 mm
Board Thickness Tolerance (Standard)	+/- 10%
Board Thickness Tolerance (Upon Request)	+/-   5%
COPPER
Max Inner Layer Copper Thickness	4oz	0.14 mm
Min Inner Layer Copper Thickness	0.3 oz	0.01 mm
Max Outer Layer Copper Thickness	7oz	0.243 mm
Min Outer Layer Copper Thickness	0.75 oz	0.026 mm
DRILL
Min Drill  Size	8 mil	0.203 mm
Min Laser Drill Size	3 mil	0.076 mm
Min Mechanical Aspect Ratio (Laminate / Drill)	12/1
TRACES / SPACES
Line Width/Spacing (Outer Layer)	2.5 / 3 mil	0.0635 mm/0.0752 mm
Min Line Width/Spacing (Inner Layer)	2.5 / 3 mil	0.0635 mm/0.0752 mm
Min SMT Pitch	6 mil	0.15 mm
Min BGA Pitch	4 mil	0.1 mm
SOLDER MASK
Min Solder Mask Print Width (Mask Dam)	3 mil	0.076 mm
Solder Mask Registration Tolerance	+/- 2 mil	0.050 mm
CONTROLLED IMPEDANCE
Controlled Impedance (Standard)	45 Ohm +/- 10%
Controlled Impedance (Upon Request)	40 Ohm +/-   7%
SURFACE FINISHES
Lead Solder (HASL)	OSP (Entek)
Lead Free Solder (HASL)	Deep/Hard Gold (Electrolytic Nickel Gold)
Immersion Gold (Electroless Nickel Gold - ENIG)	Wirebondable Gold (99.99% Pure Gold)
Immersion Silver	Flash Gold
Immersion Tin (White Tin)	Carbon Ink
MATERIALS
FR4 (140°C Tg) Standard  (Nan-Ya, Norplex, ITEQ)	Rogers
FR4 (180°C Tg) High Temp  (Nan-Ya, Norplex, ITEQ)	Polyimide (Kapton)
Arlon	Nelco
GeTek	Alumina
Ceramic	Bakelite