If you prefer to send us your files for a quote, or if you have manufacturing questions,
please call us toll free at 888-775-PCBU (7228) or contact us; we will be glad to help!
Up to 42 layers
RoHS Finishes
(ENIG, Immersion Silver, OSP,
Lead Free Solder, Immersion Tin)
| Min Trace/Space | 3 mil |
| Min Mechanical Drill | 8 mil |
| Min Laser Drill | 3 mil |
BGA ASSEMBLY CAPABILITIES
1. Automatic placement of CBGA, PBGA, MBGA Verification of BGA's using real-time x-ray system.
2. Removing & Replacing BGA's & MBGA's, Experienced with Ceramic & Plastic BGA's, Reballing BGA's & MBGA.
SMT ASSEMBLY CAPABILITIES
1. Ball Grid Array (BGA)
2. Ultra-Fine Ball Grid Array (uBGA)
3. Quad Flat Pack No-Lead (QFN)
4. Quad Flat Package (QFP)
5. Plastic Leaded Chip Carrier (PLCC)
6. SOIC, Package-On-Package (PoP)
7. Small Chip Packages (Pitch of 0.2 mm)
THROUGH-HOLE ASSEMBLY
Automated Through-Hole Assembly
Manual Through-Hole Assembly
Through-hole mounting techniques are now usually reserved for bulkier or heavier components such as electrolytic capacitors or electromechanical relays that require great strength in support
MIXED ASSEMBLY ADVANTAGES
Mixed Assembly - Through-Hole, SMT and BGA components are housed on the PCB. Single- or double-sided mixed technology or SMT (Surface Mount) for PCB assembly. Single- or double-sided BGA and micro-BGA installation and rework with 100% X-ray inspection