PCB Universe, your best source for
high quality, low cost Printed Circuit Boards.
If you prefer to send us your files for a quote, or if you have manufacturing questions,
please call us toll free at 888-775-PCBU (7228) or contact us; we will be glad to help!
- No Tooling/Test Charge
- Free DFM Review on Every Order
- Instant PCB Quote
- Blazing Fast Lead Times
- Proto + Production Quantities
- ISO – UL Certified Manufacturing
- Full Turnkey Assembly Capabilities
Click here to get a fast PCB quote →
PCB Universe is a leading printed circuit board manufacturing service. We have leading-edge capabilities to address all product requirements and to support any design criteria. We can supply our customers with all manner of circuit board design, style, production, and testing thereby addressing all circuit board requirements and needs.
Our pricing is among the best. Our printed circuit boards are manufactured to comply with ISO-9001-2015, UL, and RoHS standards. With decades of experience bringing you high quality, low prices, and exceptional service, PCB Universe has solutions for all of your printed circuit board needs. Send your requirements and Gerber files for complimentary price quotes or click the link above for an Instant PCB Quote. You'll be happy you found us.
Up to 42 layers
(ENIG, Immersion Silver, OSP,
Lead Free Solder, Immersion Tin)
|Min Mechanical Drill
|Min Laser Drill
Blind & Buried Vias
Class II & Class III
Rigid, Flex, Rigid Flex and Aluminum
Free DFM Review
on every order!
BGA ASSEMBLY CAPABILITIES
1. Automatic placement of CBGA, PBGA, MBGA Verification of BGA's using real-time x-ray system.
2. Removing & Replacing BGA's & MBGA's, Experienced with Ceramic & Plastic BGA's, Reballing BGA's & MBGA.
SMT ASSEMBLY CAPABILITIES
1. Ball Grid Array (BGA)
2. Ultra-Fine Ball Grid Array (uBGA)
3. Quad Flat Pack No-Lead (QFN)
4. Quad Flat Package (QFP)
5. Plastic Leaded Chip Carrier (PLCC)
6. SOIC, Package-On-Package (PoP)
7. Small Chip Packages (Pitch of 0.2 mm)
Automated Through-Hole Assembly
Manual Through-Hole Assembly
Through-hole mounting techniques are now usually reserved for bulkier or heavier components such as electrolytic capacitors or electromechanical relays that require great strength in support
MIXED ASSEMBLY ADVANTAGES
Mixed Assembly - Through-Hole, SMT and BGA components are housed on the PCB. Single- or double-sided mixed technology or SMT (Surface Mount) for PCB assembly. Single- or double-sided BGA and micro-BGA installation and rework with 100% X-ray inspection
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